2nd: ISSP '93 (Tokyo)
Outline
- Date: May 27-28, 1993
- Venue: Schönbach-Sabô, Tokyo, Japan
- Theme: Fundamentals of Sputtering and its Applications for Electronic Materials
Invited Speakers
- G. Betz (Technische Universitat Wlen, AUSTRIA)
- Hynek Biederman (Charles University, CZECH REPUBLIC )
- Brian Chapman (LUCAS LABS, , USA )
- John W. Coburn (IBM Research Division, USA )
- George J. Collins (Colorado State University, USA)
- David W. Hoffman (Ford Motor Company, USA)
- G. Marletta (Universita di Catania, ITALY )
- T. Ohmi (Tohoku University, JAPAN)
- S. Shingubara (Hiroshima University, JAPAN)
- Tom Smy (Carleton University , CANADA)
- G. K. Vinogradov (Nagoya University, JAPAN)
Contact to: ISSP Webmaster (webmaster@issparchive.org)
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