ISSP2007: Exhibit

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The ISSP Panel Exhibit will be held in conjunction with ISSP2007. It will feature the broad spectrum of equipment, instruments, materials, systems, services, etc. for sputtering and plasma processes. At the last Exhibit, ISSP2005, 22 companies exhibited their offerings, and exchanged the information with over 300 attendees. This is the best opportunity for you to present, face-to-face, your products and services to a vital market. The Panel Exhibit will be opened parallel to ISSP2007 poster presentation at the same room. The ISSP2007 committee requests your company to attend this exhibition as an exhibitor. Please don't miss the terrific opportunity!

Be careful that the ISSP2007 Exhibit is different from the Manufacturer's Presentation of ISSP2007 which is a technical presentation made by invited manufacturer.

exhibit room
The Panel Exhibit and the Poster Session in the past ISSP

ISSP2007 Exhibitors

Advanced Energy Japan K.K. PEGASUS Software INC.
Advanced Energy Japan K.K. PEGASUS Software INC.
 
Astech Corp. SHINCRON CO., LTD.
Astech Corp. SHINCRON CO., LTD.
 
CANON ANELVA CORPORATION SHOWA SHINKU CO., LTD
CANON ANELVA CORPORATION SHOWA SHINKU CO., LTD
 
FTS Corporation THERMO RIKO CO., LTD.
FTS Corporation THERMO RIKO CO., LTD.
 
Fujikin Incorporated ULVAC CRYOGENICS INCORPORATED
Fujikin Incorporated ULVAC CRYOGENICS INCORPORATED
 
HÜTTINGER Electronic K.K. ULVAC, Inc.
HÜTTINGER Electronic K.K. ULVAC, Inc.
 
Landmark Technology Corporation ULVAC-PHI, Inc.
Landmark Technology Corporation ULVAC-PHI, Inc.
 
NIPPON MINING & METALS Co., Ltd. Universal Systems Co., Ltd.
NIPPON MINING & METALS Co., Ltd. Universal Systems Co., Ltd.
 
Oerlikon Japan Co., Ltd.  
Oerlikon Japan Co., Ltd.  

Exhibit Details

Scope

  • Process equipment (sputtering, evaporation, MBE, CVD, etching, etc.)
  • Analyzer, controller, and measurement apparatus
  • Related materials and components (Sputtering target, etc.)

Location and term

  • Kanazawa Kokusai Hotel
  • Exhibit: From 17:00 June 6 to 14:00 June 8, 2007 (Symposium: From 10:00 June 6 to 14:00 June 8)

Exhibit fee

  • ¥120,000/unit (Japanese yen)
  • (Including the exhibit fee ¥100,000 and the registration fee ¥20,000)

Special favor

How to apply

  • Please fill the application form (Microsoft Word) and send it to the committee member by email.
  • Please attach the banner image file of your company, in case that you wish to make link point of your company's home page on the ISSP2007 web site.

Deadline: April 27, 2007

  • If you want to apply the one-page advertisement on the proceedings, please send a PDF file or a paper-printed copy to the committee member (see the end of this page).

Policy

Configuration

desk

Questions and Application

  • ISSP2007 Secretariat
  • Advanced Material Science Center, Kanazawa Institute of Technology
  • 3-1, Yatsukaho, Hakusan, Ishikawa 924-0838, JAPAN
  • TEL: +81-76-274-9250 FAX: +81-76-274-9251
  • E-mail: exhibit@issp2007.org

Exhibitors of the Past ISSP Exhibit

  • Advanced Energy Japan
  • AIMEC Corp.
  • ASTECH Corp.
  • BOC Coating Technology
  • Canon ANELVA Corp.
  • ENI JAPAN Ltd.
  • Fraunhofer-Institut für Elektronenstrahl-und Plasmatechnik
  • FTS Corp.
  • Gencoa Ltd.
  • Hakuto Co., Ltd.
  • HITACHI ZOSEN Corp.
  • Hüttinger Electronik GmbH
  • JAPAN ENERGY Corp.
  • JEOL Ltd.
  • Kurt J. Lesker Company
  • Landmark Technology Corp.
  • MARUBUN Corp.
  • Matsubo Co., Ltd.
  • MITSUBISHI MATERIALS Corp.
  • Oerlikon Japan Co., Ltd.
  • Oerlikon Leybold Vacuum Japan Co., Ltd.
  • NANO SCIENCE CORPORATION
  • NANOMETRICS JAPAN
  • NIHON VEECO K. K.
  • NIPPON MINING & METALS CO., LTD.
  • NOA SYSTEMS Inc.
  • NTT AFTY Corp.
  • OXFORD INSTRUMENTS
  • PEGASUS Software Inc.
  • SAES GETTERS JAPAN Co., Ltd.
  • Sanyu Electron Co., Ltd.
  • Science Technology Co., Ltd.
  • SHINCRON Co., Ltd.
  • SHOWA SHINKU Co., Ltd.
  • Singulus Technologies AG
  • Sputtered Films, Inc.
  • TDY INC.
  • THERMO RIKO CO., LTD.
  • ULVAC CRYOGENICS INC.
  • ULVAC JAPAN, Ltd.
  • ULVAC-PHI, INC.
  • UNIVERSAL SYSTEMS Co., Ltd.
  • VACUUM METALLUGICAL Co., Ltd.
  • VIC International Co., Ltd.

Contact to: ISSP2007 secretariat (Contact Information)