ISSP2009: Exhibit

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ISSP2009 exhibit has successfully been held. The ISSP committee gratefully acknowledges the exhibitors and all the participants of the symposium.

The ISSP Panel Exhibit will be held in conjunction with the 10th International Symposium on Sputtering and Plasma Processes (ISSP2009) at the Kanazawa Kokusai Hotel from July 8 to 10, 2009. It will feature the broad spectrum of equipment, instruments, materials, systems, services, etc. for sputtering and plasma processes. At the last Exhibit, ISSP2007, 17 companies exhibited their offerings, and exchanged the information with over 300 attendees. This is the best opportunity for you to present, face-to-face, your products and services to a vital market. The Panel Exhibit will be opened parallel to ISSP2009 poster presentation at the same room. The ISSP2009 committee requests your company to attend this exhibition as an exhibitor. Please don't miss the great opportunity!

exhibit room
The Panel Exhibit and the Poster Session in the past ISSP

ISSP2009 Exhibitors

Astech Corporation PEGASUS Software Inc.
Astech Corporation PEGASUS Software Inc.
 
FTS Corporation Rigaku Corporation
Rigaku Corporation
 
General Vacuum Equipment LTD SurFtech Transnational Co., Ltd. & Fraunhofer FEP
 
 
HUETTINGER Electronic K.K. ULVAC CRYOGENICS INC.
ULVAC CRYOGENICS INC.
 
MAKPLE Co., Ltd. ULVAC TECHNO. Ltd.
MAKPLE Co., Ltd. ULVAC TECHNO. Ltd.
 
NIPPON MINING & METALS Co., Ltd. ULVAC, Inc.
NIPPON MINING & METALS Co., Ltd. ULVAC, Inc.
 
Omicron NanoTechnology Japan Inc. VON ARDENNE Anlagentechnik GmbH
Omicron NanoTechnology Japan Inc.

Contact to: ISSP2009 secretariat (Contact Information)