| Country | Attendance |
|---|---|
| China | 1 |
| France | 1 |
| Germany | 9 |
| Hong Kong | 1 |
| Iceland | 1 |
| India | 1 |
| Korea | 7 |
| The Netherlands | 1 |
| Singapore | 1 |
| Sweden | 3 |
| Taiwan | 42 |
| Thailand | 2 |
| UK | 3 |
| USA | 5 |
| Japan | 183 |
| Total | 261 |
| Invited | Contributed | Total | ||
|---|---|---|---|---|
| Oral | Poster | |||
| Opening | 2 | 2 | ||
| Fundamentals of Sputtering and Plasma Processes | 1 | 3 | 1 | 5 |
| Sputtering Processes | 5 | 7 | 12 | 24 |
| Plasma Processes | 1 | 3 | 10 | 14 |
| Plasma Induced Process Technologies | 1 | 0 | 4 | 5 |
| Thin Films | 3 | 18 | 58 | 79 |
| Micro and Nano Technologies | 1 | 6 | 14 | 21 |
| Applications | 2 | 4 | 17 | 23 |
| Total | 16 | 41 | 116 | 173 |
| Last Updated: 2010-01-22 |
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