ISSP2013: Poster Award Winners
Following three groups have won the Poster Awards of ISSP2013 meeting. Congratulations!
Z. Kelgenbaeva1), E. Omurzak2), S. Sulaimankulova3), M. Goto2), T. Mashimo4)
1) Graduate School of Science and Technology, Kumamoto University, Japan,
2) Priority Organization of Innovation and Excellence, Kumamoto University, Japan,
3) National Academy of Science of the Kyrgyz Republic, Kyrgyzstan,
4) Shock wave and Condensed Matter research Center, Kumamoto University, Japan
MN P-4: Effect of temperature condition and surfactant on the formation of iron nanoparticle using pulsed plasma in liquid
Comment from Ms. Kelgenbaeva
It is a great pleasure to receive the ISSP 2013 Best Poster Award and I highly apprecia
te all supportive co-workers.
This award not only brings me honor and happiness, but also
encourages me in my continued future research.
Thank you very much.
T. Hanada1), K. Yanachi1), H. Ishizaki1), Y. Otani1), C. Yamamoto2), J. Yamanaka3), T. Sato2), T. Takamatsu4), Y. Fukuda1)
1) Tokyo University of Science, Suwa, Japan,
2) University of Yamanashi, Japan,
3) University of Yamanashi, Japan, 4) SST Inc., Japan
PI P-1: In situ formation of aluminum germanate interlayer for high-k/Ge metal-oxide-semiconductor structures by atomic layer deposition with trimethylaluminum and microwave-generated atomic oxygen
Comment from Mr. Yanachi
I am very glad for receiving the best poster award. For future works, I
shall investigate the development of Ge-MOS device. Thank you for your
kind.
N. Itagaki1,2), K. Kuwahara1), I. Suhariadi1), K. Oshikawa1), K. Matsushima1), D. Yamashita1), H. Seo1), K. Kamataki1), G. Uchida1), K. Koga1), M. Shiratani1)
1) Kyushu University, Japan,
2) PRESTO, Japan
TF 1-3: Sputter deposition of single crystal ZnO films on 18% lattice mismatched c-Al2O3 substrates via nitrogen mediated crystallization
Comment from Prof. Itagaki
We're all delighted to be chosen for this award. ISSP is
indeed a great conference where we can have fulfilling discussions
on sputtering & plasma processes, which should bring further
advances in our research. We wish to thank the organizers
and hope to see you at next ISSP.
Contact to: ISSP2013 Office (Contact Information)