ISSP2013: Symposium Outline

International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The main subject of the 1st symposium was “Reactive Sputtering”. It was the time that some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively.

This symposium has two characteristics. One is that the program committee is formed mainly by members from related industries. Hence, the general tendency of papers presented in the symposium is practical use of the sputtering technology and industrial relevancy. The other is that all the oral speakers including invited ones are requested to present their papers also at the poster session of the day of the oral presentation, giving unique opportunities for attendees to discuss details of the oral presentations with speakers.

We hope that every engineer and researcher in the world who is interested in sputtering and plasma processes attends this exciting symposium. We look forward to seeing you in Kyoto, Japan.

Akira Kinbara, Chair of the International Advisory Committee

Location and Date

Venue: KYOTO RESEARCH PARK, Kyoto, Japan
Date: July 10-12, 2013

Symposium Details

Subject Areas

Fundamentals of Sputtering and Plasma Processes
Sputtering Processes
Plasma Processes
Plasma Induced Process Technologies
Thin Films
Micro and Nano Technologies
Applications
Others

Language

English

Presentation Styles

Invited Presentation	(40 minute oral and poster)
Presentation A	(20 minute oral and poster)
Presentation B	(poster)

All oral presentations are also discussed in the poster session.

On-site Proceedings

Participants will receive one copy of the on-site proceedings at the symposium.

Post-symposium proceedings

Peer-reviewed symposium papers will be published in the special issue of Journal of Vacuum Science & Technology A.

Registration fee

	Before June 14, 2013	After June 14, 2013
Member of SP-bukai, Vac. Soc. Jpn.	¥40,000	¥45,000
Member of Sponsoring Society	¥45,000	¥50,000
Member of Assisting Society	¥52,000	¥57,000
Students	¥20,000	¥25,000
Others	¥55,000	¥60,000

Registration will be open from early March.

ISSP Award

One "Best Poster Award" and two "Poster Awards" will be given to the author(s) of the outstanding poster presentations. Oral papers will be judged on their poster presentations. The award ceremony will be held at the last day of the symposium (July 12).

Contact to: ISSP2013 Office (Contact Information)