ISSP2013: Exhibit
The ISSP Panel Exhibit will be held in conjunction with The 12th International Symposium on Sputtering and Plasma Processes (ISSP2013) at the Kyoto Research Park from July 10 to 12, 2013. It will feature the broad spectrum of equipment, instruments, materials, systems, services, etc. for sputtering and plasma processes. At the last Exhibit, ISSP2011, 18 companies exhibited their offerings, and exchanged the information with about 300 attendees. This is the best opportunity for you to present, face-to-face, your products and services to a vital market. The Panel Exhibit will be opened parallel to ISSP2013 poster presentation at the same room. The ISSP2013 committee requests your company to attend this exhibition as an exhibitor. Please don't miss the terrific opportunity!
Your presentation at the technical session of the symposium is strongly recommended as well as the panel exhibit, which is expected to dramatically improve the impact of your company. (In this case, please apply as a normal presenting author.)
Notice: ISSP2013 Exhibit is NOT the Manufacturer's Presentation which will be included in the technical program.
ISSP2013 Exhibitors
Exhibit Details
Scope
- Process equipment (sputtering, evaporation, MBE, CVD, etching, etc.)
- Analyzer, controller, and measurement apparatus
- Related materials and components (Sputtering target, etc.)
Location and term
- Kyoto Research Park, Kyoto, Japan
- Exhibit: From 17:00 July 10 to 17:00 July 12, 2013 (Symposium: From 10:00 July 10 to 17:00 July 12)
(Closing time is tentative.)
Exhibit fee
- ¥120,000/unit (Japanese yen)
- (Including the exhibit fee ¥100,000 and the registration fee ¥20,000)
Special favor
- The exhibitor can show one-page, monochrome advertisement on the programs (print media) and one-page, color advertisement on the proceedings (CD-ROM) for free. Please tolerate that the printing quality is not so high grade.
- We prepare a link to your home site on our web page, http://issp2013.org/, according to your request.
- In accordance with the request of exhibitor, an automatic CM slide presentation by Powerpoint (without sound, 30sec/company, no page limit) will be available during the break time of oral session. (Details will be informed later.)
How to apply
- Please fill the application form (Microsoft Word Document) and send it to exhibit@issp2013.org by email.
- Please attach the banner image file of your company, in case that you wish to make link point of your company's home page on the ISSP2013 web site.
Deadline: May 16, 2013
- If you want to apply the one-page advertisement on the proceedings and on the programs, please send a PDF file (font embedding) to the committee office (see the end of this article).
Policy
- Description language is English.
- At least one person is required to explain the panels. He/she is entitled to attend all the session of ISSP2013 for free.
- For extra two persons of exhibitor, the registration fee is ¥20,000 per person. From the 4th person and up, please register as a normal participant.
- The carriage of all the exhibiting materials is to be made by yourself.
- Don't remove the panel before the closing of ISSP2013.
Configuration
- One unit of exhibition space consists of a panel of about 180 cm (width) x 200 cm (height) and a desk of 180 cm (width) x 60 cm (depth) x 70 cm (height).
- The total weight of exhibiting materials on the desk should be less than 10 kg.
- If you need more space, you may use multiple exhibition units by paying additional fee. The acceptance will be informed later.
- Utilities of electrical power are available for personal computer use. It, however, is limited to 2 A (AC 100 V).
- If you would like to make any special exhibition, please consult with us.
Questions and Application
- ISSP2013 Office
- Advanced Material Science Center, Kanazawa Institute of Technology
- 3-1, Yatsukaho, Hakusan, Ishikawa 924-0838, JAPAN
- TEL: +81-76-274-9250 FAX: +81-76-274-9251
- E-mail: exhibit@issp2013.org
Exhibitors of the Past ISSP Exhibit
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Contact to: ISSP2013 secretariat (Contact Information)
| Last Updated: 2013-08-26 |
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