ISSP2011: Exhibit

[ English | Japanese ]
(Print version of this page)

The ISSP Panel Exhibit will be held in conjunction with The 11th International Symposium on Sputtering and Plasma Processes (ISSP2011) at the Kyoto Research Park from July 6 to 8, 2011. It will feature the broad spectrum of equipment, instruments, materials, systems, services, etc. for sputtering and plasma processes. At the last Exhibit, ISSP2009, 15 companies exhibited their offerings, and exchanged the information with about 300 attendees. This is the best opportunity for you to present, face-to-face, your products and services to a vital market. The Panel Exhibit will be opened parallel to ISSP2011 poster presentation at the same room. The ISSP2011 committee requests your company to attend this exhibition as an exhibitor. Please don't miss the terrific opportunity!

Your presentation at the technical session of the symposium is strongly recommended as well as the panel exhibit, which is expected to dramatically improve the impact of your company. (In this case, please apply as a normal presenting author.)

Notice: ISSP2011 Exhibit is NOT the Manufacturer's Presentation which will be included in the technical program.

ISSP2011 Exhibitors

ASTECH CORPORATION PEGASUS Software Inc.
ASTECH CORPORATION PEGASUS Software Inc.
 
CSM Instruments SA SHOWA SHINKU CO.,LTD.
CSM Instruments SA
 
EIKO Corp. /EIKO Engineering Co., Ltd. THERMO RIKO CO., LTD.
EIKO Corp. /EIKO Engineering Co., Ltd. THERMO RIKO CO., LTD.
 
FTS CORPORATION Techscience Ltd.
Techscience Ltd.
 
HEMMI Slide Rule Co.,Ltd. ULVAC CRYOGENICS INCORPORATED
HEMMI Slide Rule Co.,Ltd. ULVAC CRYOGENICS INCORPORATED
 
HUETTINGER Electronic K.K. ULVAC TECHNO, Ltd.
HUETTINGER Electronic K.K. ULVAC TECHNO, Ltd.
 
J. A. Woollam Japan Corporation ULVAC, Inc.
J. A. Woollam Japan Corporation ULVAC, Inc.
 
JX Nippon Mining & Metals Corporation VON ARDENNE, Germany
JX Nippon Mining & Metals Corporation VON ARDENNE, Germany
 
KITANO SEIKI CO., LTD. WaveFront Co., Ltd.
KITANO SEIKI CO., LTD. WaveFront Co., Ltd.

Exhibit Details

Scope

  • Process equipment (sputtering, evaporation, MBE, CVD, etching, etc.)
  • Analyzer, controller, and measurement apparatus
  • Related materials and components (Sputtering target, etc.)

Location and term

  • Kyoto Research Park, Kyoto, Japan
  • Exhibit: From 17:00 July 6 to 17:00 July 8, 2011 (Symposium: From 10:00 July 6 to 17:00 July 8)
    (Closing time is tentative.)

Exhibit fee

  • ¥120,000/unit (Japanese yen)
  • (Including the exhibit fee ¥100,000 and the registration fee ¥20,000)

Special favor

How to apply

  • Please fill the application form (Microsoft Word Document) and send it to exhibit@issp2011.org by email.
  • Please attach the banner image file of your company, in case that you wish to make link point of your company's home page on the ISSP2011 web site.

Deadline: May 16, 2011

  • If you want to apply the one-page advertisement on the proceedings, please send a PDF file or a paper-printed copy to the ISSP2011 secretariat (see the end of this page).

Policy

Configuration

desk

Questions and Application

  • ISSP2011 Office
  • Advanced Material Science Center, Kanazawa Institute of Technology
  • 3-1, Yatsukaho, Hakusan, Ishikawa 924-0838, JAPAN
  • TEL: +81-76-274-9250 FAX: +81-76-274-9251
  • E-mail: exhibit@issp2011.org

Exhibitors of the Past ISSP Exhibit

  • Advanced Energy Japan
  • AIMEC Corp.
  • ASTECH Corp.
  • BOC Coating Technology
  • Canon ANELVA Corp.
  • ENI JAPAN Ltd.
  • Fraunhofer-Institut für Elektronenstrahl-und Plasmatechnik
  • FTS Corp.
  • Fujikin Inc.
  • Gencoa Ltd.
  • Hakuto Co., Ltd.
  • HITACHI ZOSEN Corp.
  • Hüttinger Electronik GmbH
  • JAPAN ENERGY Corp.
  • JEOL Ltd.
  • Kurt J. Lesker Company
  • Landmark Technology Corp.
  • MAKPLE Co. Ltd
  • MARUBUN Corp.
  • Matsubo Co., Ltd.
  • MITSUBISHI MATERIALS Corp.
  • Oerlikon Japan Co., Ltd.
  • Oerlikon Leybold Vacuum Japan Co., Ltd.
  • NANO SCIENCE CORPORATION
  • NANOMETRICS JAPAN
  • NIHON VEECO K. K.
  • NIPPON MINING & METALS CO., LTD.
  • NOA SYSTEMS Inc.
  • NTT AFTY Corp.
  • OXFORD INSTRUMENTS
  • PEGASUS Software Inc.
  • SAES GETTERS JAPAN Co., Ltd.
  • Sanyu Electron Co., Ltd.
  • Science Technology Co., Ltd.
  • SHINCRON Co., Ltd.
  • SHOWA SHINKU Co., Ltd.
  • Singulus Technologies AG
  • Sputtered Films, Inc.
  • TDY INC.
  • THERMO RIKO CO., LTD.
  • ULVAC CRYOGENICS INC.
  • ULVAC JAPAN, Ltd.
  • ULVAC-PHI, INC.
  • UNIVERSAL SYSTEMS Co., Ltd.
  • VACUUM METALLUGICAL Co., Ltd.
  • VIC International Co., Ltd.
  • Von Ardenne, Germany

Contact to: ISSP2011 secretariat (Contact Information)