ISSP2011: Symposium Outline

International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The main subject of the 1st symposium was “Reactive Sputtering”. It was the time that some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively.

This symposium has two characteristics. One is that the program committee is formed mainly by members from related industries. Hence, the general tendency of papers presented in the symposium is practical use of the sputtering technology and industrial relevancy. The other is that all the oral speakers including invited ones are requested to present their papers also at the poster session of the day of the oral presentation, giving unique opportunities for attendees to discuss details of the oral presentations with speakers.

In 2009, we celebrated the 10th anniversary of ISSP. To express our deep appreciations, we selected a few dozen companies or institutes which contributed frequently to the past ISSPs as the honorees of ISSP 10th Anniversary Contribution Award. We especially thank them for their outstanding contributions to the past ISSPs.

For the symposium to be held in 2011, we plan to leave Kanazawa and move to Kyoto which also has a long history and a cultured atmosphere. In this new symposium venue, we would like to discuss the next decade perspective focusing on the main topic of “sputtering technologies in 201X”. We hope that every engineer and researcher in the world who is interested in sputtering and plasma processes attends this exciting symposium. We look forward to seeing you in Kyoto, Japan.

Akira Kinbara, Chair of the International Advisory Committee

Location and Date

Venue: KYOTO RESEARCH PARK, Kyoto, Japan
Date: July 6-8, 2011

Important Deadlines

Abstract Submission: January 17, 2011
Manuscripts for On-site proceedings: May 16, 2011
Manuscripts for VACUUM: July 8, 2011 (at the symposium)

Symposium Details

Subject Areas

Fundamentals of Sputtering and Plasma Processes
Sputtering Processes
Plasma Processes
Plasma Induced Process Technologies
Thin Films
Micro and Nano Technologies
Applications
Others

Language

English

Presentation Styles

Invited Presentation	(40 minute oral and poster)
Presentation A	(20 minute oral and poster)
Presentation B	(poster)

All oral presentations are also discussed in the poster session.

On-site Proceedings

Participants will receive one copy of the on-site proceedings at the symposium.

VACUUM Special Issue

Editor-reviewed and selected papers will be published in VACUUM Special Issue.

Registration fee

	Before June 17, 2011	After June 18, 2011
Member of SP-bukai, Vac. Soc. Jpn.	¥40,000	¥45,000
Member of Sponsoring Society	¥45,000	¥50,000
Member of Assisting Society	¥52,000	¥57,000
Students	¥20,000	¥25,000
Others	¥55,000	¥60,000

ISSP Award

One "Best Poster Award" and two "Poster Awards" will be given to the author(s) of the outstanding poster presentations. Oral papers will be judged on their poster presentations. The award ceremony will be held at the last day of the symposium (July 8).

Contact to: ISSP2011 Office (Contact Information)