ISSP2015: Exhibit

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The ISSP Panel Exhibit will be held in conjunction with The 13th International Symposium on Sputtering and Plasma Processes (ISSP2015) at the Kyoto Research Park from July 8 to 10, 2015. It will feature the broad spectrum of equipment, instruments, materials, systems, services, etc. for sputtering and plasma processes. At the last Exhibit, ISSP2013, 12 companies exhibited their offerings, and exchanged the information with about 250 attendees. This is the best opportunity for you to present, face-to-face, your products and services to a vital market. The Panel Exhibit will be opened parallel to ISSP2015 poster presentation at the same room. The ISSP2015 committee requests your company to attend this exhibition as an exhibitor. Please don't miss the terrific opportunity!

Your presentation at the technical session of the symposium is strongly recommended as well as the panel exhibit, which is expected to dramatically improve the impact of your company. (In this case, please apply as a normal presenting author.)

Notice: the ISSP2015 Panel Exhibit is NOT the Manufacturer's Presentation which will be included in the technical program.

ISSP2015 Exhibitors

APPEX CORPORATION Maintenance research corporation
APPEX CORPORATION Maintenance research corporation
 
Dan-Takuma Technologies Inc. PEGASUS Software Inc.
PEGASUS Software Inc.
 
FTS CORPORATION SHOWA SHINKU CO., LTD
SHOWA SHINKU CO., LTD
 
Gencoa Ltd. Sputtering Components, Inc.
Sputtering Components, Inc.
 
Heiwa Electric Co.,Ltd TOSOH Corporation
TOSOH Corporation
 
Impedans Ltd. Tokyo Electronics Co., Ltd.
Impedans Ltd. Tokyo Electronics Co., Ltd.
 
J. A. Woollam Japan Corporation ULVAC CRYOGENICS INCORPORATED
J. A. Woollam Japan Corporation ULVAC CRYOGENICS INCORPORATED
 
JX Nippon Mining & Metals Corporation VON ARDENNE GmbH
JX Nippon Mining & Metals Corporation
 
KITANO SEIKI CO., LTD.    
KITANO SEIKI CO., LTD.

Exhibit Details

Scope

  • Process equipment (sputtering, evaporation, MBE, CVD, ALD, etching, etc.)
  • Analyzer, analysis service, controller, simulation program and measurement apparatus
  • Related materials and components (Sputtering target, Plasma source, etc.)

Location and term

  • Location: Kyoto Research Park, Kyoto, Japan
  • Term: July 8 and 9; From 17:00 to 19:00, July 10; From 15:00 to 17:00 (Closing time is tentative.)
    • Poster session is held at the same time and location.
    • Symposium: From 10:00 July 8 to 17:00 July 10

Exhibit fee

  • ¥120,000/unit (Japanese yen, including taxes)
  • (Including the exhibit fee ¥100,000 and the registration fee ¥20,000)

Special favor

How to apply

  • Please fill the application form (Microsoft Word Document) and send it to exhibit@issp2015.org by email.
  • Please attach the banner image file of your company, in case that you wish to make link point of your company's home page on the ISSP2015 web site.

Deadline: May 15, 2015

  • If you want to apply the advertisement on the proceedings and on the programs, please send a PDF file (font embedding, one page per unit) to the committee office (see the end of this article).

Policy

Configuration

desk

Questions and Application

  • ISSP2015 Office
  • Advanced Material Science Center, Kanazawa Institute of Technology
  • 3-1, Yatsukaho, Hakusan, Ishikawa 924-0838, JAPAN
  • TEL: +81-76-274-9250 FAX: +81-76-274-9251
  • E-mail: exhibit@issp2015.org

Exhibitors of the Past ISSP Exhibit

  • Advanced Energy Japan
  • AIMEC Corp.
  • ASTECH Corp.
  • BOC Coating Technology
  • Canon ANELVA Corp.
  • CSM Instruments SA
  • EIKO Corp. /EIKO Engineering Co., Ltd.
  • ENI JAPAN Ltd.
  • Fraunhofer-Institut für Elektronenstrahl- und Plasmatechnik
  • FTS Corp.
  • Fujikin Inc.
  • Gencoa Ltd.
  • Hakuto Co., Ltd.
  • Heiwa Electric Co.,Ltd.
  • HEMMI Slide Rule Co.,Ltd.
  • HITACHI ZOSEN Corp.
  • Hüttinger Electronik GmbH
  • INI Coatings Ltd.
  • J. A. Woollam Japan Corp.
  • JEOL Ltd.
  • JX Nippon Mining & Metals Corp.
  • KITANO SEIKI CO., LTD.
  • Kurt J. Lesker Company
  • Landmark Technology Corp.
  • Maintenance Research Corp.
  • MAKPLE Co. Ltd
  • MARUBUN Corp.
  • Matsubo Co., Ltd.
  • MITSUBISHI MATERIALS Corp.
  • Oerlikon Japan Co., Ltd.
  • NANO SCIENCE CORPORATION
  • NANOMETRICS JAPAN
  • NIHON VEECO K. K.
  • NOA SYSTEMS Inc.
  • NTT AFTY Corp.
  • OXFORD INSTRUMENTS
  • PEGASUS Software Inc.
  • SAES GETTERS JAPAN Co., Ltd.
  • Sanyu Electron Co., Ltd.
  • Science Technology Co., Ltd.
  • SHINCRON Co., Ltd.
  • SHOWA SHINKU Co., Ltd.
  • Singulus Technologies AG
  • Sputtered Films, Inc.
  • TDY INC.
  • Techscience Ltd.
  • THERMO RIKO CO., LTD.
  • TOYO Corp.
  • ULVAC CRYOGENICS INC.
  • ULVAC JAPAN, Ltd.
  • ULVAC-PHI, INC.
  • UNIVERSAL SYSTEMS Co., Ltd.
  • VACUUM METALLUGICAL Co., Ltd.
  • VIC International Co., Ltd.
  • VON ARDENNE GmbH
  • WaveFront Co., Ltd.

Contact to: ISSP2015 Office (Contact Information)