ISSP2015: Symposium Outline
International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The main subject of the 1st symposium was “Reactive Sputtering”. It was the time that some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively.
This symposium has two characteristics. One is that the program committee is formed mainly by members from related industries. Hence, the general tendency of papers presented in the symposium is practical use of the sputtering technology and industrial relevancy. The other is that all the oral speakers including invited ones are requested to present their papers also at the poster session of the day of the oral presentation, giving unique opportunities for attendees to discuss details of the oral presentations with speakers.
We hope that every engineer and researcher in the world who is interested in sputtering and plasma processes attends this exciting symposium. We look forward to seeing you in Kyoto, Japan.
Location and Date
- Venue: KYOTO RESEARCH PARK, Kyoto, Japan
- Date: July 8-10, 2015
Important Deadlines
- Abstract Submission: January 26, 2015 (extended)
- Manuscripts for On-site proceedings: May 18, 2015
- Manuscripts for post-symposium proceedings (JVST A): September 7, 2015
Symposium Details
Subject Areas
- Fundamentals of Sputtering and Plasma Processes
- Sputtering Processes
- Plasma Processes
- Plasma Induced Process Technologies
- Thin Films
- Micro and Nano Technologies
- Applications
- Others
Language
English
Presentation Styles
| Invited Presentation | (40 minute oral and poster) |
| Presentation A | (20 minute oral and poster) |
| Presentation B | (poster) |
All oral presentations are also discussed in the poster session.
On-site Proceedings
Participants will receive one copy of the on-site proceedings at the symposium.
Post-symposium proceedings
Peer-reviewed and selected papers will be published in Journal of Vacuum Science & Technology A.
Registration fee
| Before June 5, 2015 | After June 5, 2015 | |
| Member of SP-bukai, Vac. Soc. Jpn. | ¥40,000 | ¥45,000 |
| Member of Sponsoring Society | ¥45,000 | ¥50,000 |
| Member of Assisting Society | ¥52,000 | ¥57,000 |
| Students | ¥20,000 | ¥25,000 |
| Others | ¥55,000 | ¥60,000 |
Registration will be open from early March.
ISSP Award
One "Best Poster Award" and two "Poster Awards" will be given to the author(s) of the outstanding poster presentations. Oral papers will be judged on their poster presentations. The award ceremony will be held at the last day of the symposium (July 10).
Contact to: ISSP2015 Office (Contact Information)
| Last Updated: 2015-01-20 |
|
